Samsung Group unveiled plans for a sweeping transformation of its businesses, introducing AI extensively across its companies covering functions from marketing to manufacturing.

The conglomerate believes widespread adoption across its affiliates, which includes Samsung Electronics, will fundamentally change working style and culture across the organisations.

Samsung highlighted it had pioneered the use of AI in consumer devices and wanted to “strongly apply” it to eight major business processes: development, purchasing, manufacturing, logistics, marketing, sales, service and management support.

“To enhance business competitiveness amid rapidly changing business environments, Samsung plans to officially introduce external generative AI services such as Gemini, ChatGPT, and Claude across all affiliates in June,” the company added.

Specific aims include enhancing productivity in software and marketing, and upping “operational innovation” in manufacturing.

The company asserted AI was not “just a new technology or a simple tool for improving operations, but rather an innovative technique that triggers fundamental changes in management, actively utilising it as a starting point for discovering new growth momentum”.

To help push the initiative all executives from its companies are set to go through a training camp by the end of 2026, with all 50 CEOs to take the course this month.

It plans to extend the training to eventually cover all employees. Dedicated AI teams are also to be placed across the organisation’s businesses.

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MediaTek and Samsung completed what they claimed was the first successful test of a 3Tx five-layer uplink configuration, achieving a total uplink throughput of 670 Mb/s in a joint demonstration.

The test combined MediaTek’s M90 5G modem platform with Samsung’s virtualised RAN (vRAN), Massive-MIMO radios, and Macro radios to set “a new standard in 5G uplink performance”.

The trial integrated three transmit antennas (3Tx) across five uplink layers, using a multi-band setup which combined n66 (1.7GHz) as the primary cell and dual n77 (3.7GHz) carriers.

The configuration represents an extension of earlier three transmit antenna work by using five uplink layers to push spectral efficiency and peak upload speeds beyond previously demonstrated benchmarks.

Samsung’s vRAN provided the network backbone for the trial, with the virtualised architecture allowing flexible resource allocation across multiple frequency bands while serving multiple users simultaneously. Massive-MIMO radios handled advanced antenna processing to manage the parallel data streams with reduced interference.

HC Hwang, GM of wireless communication systems and partnerships at MediaTek, stated the validation marks a significant step for the company’s 5G platform as demand for high-resolution cloud applications continues to grow.

Dongwoo Lee, head of technology solution Group at Samsung Networks, stated the results demonstrate speeds capable of meaningfully improving user experience across both consumer and enterprise applications.

The companies explained the achievement strengthens fixed wireless access performance with improved uplink peak speeds.

The companies did not announce a timeline for commercial deployment.

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Samsung Electronics began sampling its latest high bandwidth memory (HBM) units among selected customers, a chip it asserted helps maximise computing performance for large language models (LLMs) and next-generation AI systems.

Claiming an industry first with the 12-layer HBM4E unit, the company noted the release followed mass production and commercial shipment of its HBM4 earlier this year.

The latest release is said to achieve transfer speeds of up to 16Gb/s with improved energy efficiency and thermal performance.

Samsung head of memory development Sang Joon Hwang said the company had “once again demonstrated its distinct technological edge with HBM4E”.

“Through our advanced manufacturing capabilities and pre-emptive infrastructure investments, we will continue to drive the growth of the global AI memory market.”

Samsung noted the chip “delivers a stable pin speed of 14Gb/s”, a 20% increase over the HBM4. The rate of the latest product can be scaled up to 16Gb/s “to support increasingly intensive data processing requirements,” it added.

The company added its “comprehensive portfolio spanning memory, foundry, logic design and advanced packaging” meant it would be able to “continue to ensure a stable semiconductor supply for the booming AI market”.

Along with peers, Samsung has been reaping the rewards of high demand and associated price rises for memory chips driven by global demand for AI systems.

Samsung booked record quarterly sales for its memory business in Q1, attributed to addressing “high-value-added AI demand despite limited supply availability”.

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